Xiaomi Xring O3, Xring O100 and Xring D100 Announced; Chinese Tech Giant Reveals New Proprietary Processors and AI Chips; Details Here
Xiaomi has unveiled three major new processors: the 3nm Xring O3 mobile chip, the 6nm O100 AI accelerator, and the D100 smart-driving chip. Demonstrated together in an AI Cube prototype, the custom silicon lineup aims to reduce reliance on external suppliers. Check more details about each chip here.
Beijing, August 24: Chinese consumer electronics major Xiaomi has significantly expanded its proprietary semiconductor portfolio by announcing a powerful lineup of custom processors. The sweeping hardware rollout includes high-performance mobile silicon, advanced edge accelerators, and intelligent driving chips designed to strengthen supply chain independence across its broader ecosystem.
Xiaomi Xring O3
The newly introduced Xring O3 flagship mobile processor is built on TSMC's advanced 3nm process node and features a 10-core CPU architecture paired with a 16-core G2-Ultra NX GPU. As per a post by Xiaomi, the chipset breaks the 5 million-point threshold on AnTuTu benchmarks and introduces support for next-generation LPDDR6 RAM. It also integrates a reconstructed 4-core NPU delivering 200 TOPS of tensor performance. The processor is scheduled to debut next month, powering the upcoming Xiaomi 18 Fold foldable smartphone and Xiaomi Pad 9 Pro Max.
Xiaomi Xring O100
Expanding into localized artificial intelligence architecture, Xiaomi detailed the Xring O100, an AI-focused accelerator chip built on a 6nm process. The processor utilizes a near-memory design with vertical chip-and-memory stacking via Wafer-on-Wafer packaging to eliminate processing bottlenecks. By utilizing millions of high-speed vertical channels, it achieves an ultra-high bandwidth of 1.22 TB/s. The chip is engineered to support intensive on-device AI workloads locally across smartphones, connected vehicles, and robotics.
Xiaomi Xring D100
The company further introduced the Xring D100, positioned as a 3nm high-computing-power smart-driving AI processor tailored for intelligent automotive systems. This specialized silicon features a robust 20-core CPU and a 16-core NPU, supporting up to 160GB of unified memory. It is capable of running ultra-large language models with up to 200 billion parameters locally. Having completed internal validation, the D100 is slated for commercial deployment in vehicles by 2027.
Xiaomi AI Cube Prototype
Highlighting the synergy of its custom silicon, Xiaomi showcased an engineering mini PC system known as the AI Cube Prototype. This demonstration hardware integrates the Xring O3, Xring O100, and Xring D100 chips into a single unified terminal capable of delivering up to 150W of sustained performance. The prototype successfully executes complex local tasks, running large language models with 120 billion and 3 billion parameters simultaneously while switching dynamically between fast and slow operating systems.
(The above story first appeared on LatestLY on Aug 24, 2026 04:04 PM IST. For more news and updates on politics, world, sports, entertainment and lifestyle, log on to our website latestly.com).