News
The US-based Chipmaker #Qualcomm Has Announced Two New Feature-packed, ... - Latest Tweet by IANS India
The latest Tweet by IANS India states, 'The US-based chipmaker #Qualcomm has announced two new feature-packed, ultra-low-power wireless audio platforms -- S5 Sound Platform and S3 Sound Platform -- with support for #Snapdragon Sound technology.'
The US-based chipmaker #Qualcomm (@Qualcomm) has announced two new feature-packed, ultra-low-power wireless audio platforms -- S5 Sound Platform and S3 Sound Platform -- with support for #Snapdragon Sound technology. pic.twitter.com/nJACYqO0Wt— IANS Tweets (@ians_india) March 1, 2022
(The above story first appeared on LatestLY on Mar 01, 2022 11:53 AM IST. For more news and updates on politics, world, sports, entertainment and lifestyle, log on to our website latestly.com).
